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Sponge Pad Intake Cover

Pad / Cushioning Material

The primary use would be on flip chip packages with an exposed die. The exposed die is fragile, and the edges and corners can be damaged if the heat sink is not level when it is installed. The pads can be installed on the heat sink or the chip’s substrate. The pad material will cushion the heat sink and keep it level while the clip, screws, or push pins are secured.

Model Size
(mm)
Thickness
(mm)
UL Catalog Memo
SP7
SP7 Picture ø7
(8 pieces per set)
2.135 Sponge :
UL94HF-1
catalog
PDF
  • Material property
Density : 0.180g/cm³
Hardness : 10 deg(c type)
25% compression load :
0.029 - 0.058MPa

  • One-side adhesive
SP-7-1-SRU
SP-7-1-SRU Picture ø7
(8 pieces per set)
1.150 Sponge :
UL94HBF

Adhesive :
UL94VTM-0
catalog
PDF
  • Material property
Density : 0.4g/cm³
25% compression load :
0.015MPa

  • One-side adhesive
SP-32-23-1-SRU
SP-32-23-1-SRU Picture 32/23 catalog
PDF

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Intake Cover

Please refer to the heat sink specifications for details regarding these individual components.

Model Heat Sink Memo
CT607-SPC
FH6020 Includes separate spacers
CT6011
FH6030, PAL6030 Spacer incorporated into the intake cover design
CT6016
PAL6035 Spacer incorporated into the intake cover design
CT808-SPC
FH8025 Includes separate spacers
CT8017A
FH8040 Spacer incorporated into the intake cover design
CT8917
PAL8942 Spacer incorporated into the intake cover design
CT8925
S-PAL8952 Spacer incorporated into the intake cover design
CT908-SPC
FH9025 Includes separate spacers
CT9017-SPC
FH9040 Includes separate spacers
CT1008-SPC
FH10025, FHC10025 Includes separate spacers
CT10017-SPC
FH10040, FHC10040 Includes separate spacers
CS61
PEP66

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