There are many different devices (ASICS, FPGAs, CPUs, etc..). Each with a different mechanical and thermal requirement. To meet with these requirements, it is important to select an appropriate heat sink and attachment method.
The QuickSet series was developed to meet these requirements. Heat Sinks are mounted directly to the PCB with anchor pins that take up a minimum of board real estate. Attachment forces and shock loads are transmitted to the PCB instead of the chip and solder balls. The attachment force from the torsion springs generates the appropriate attachment load to the heat sinks and mounting pressure on the thermal interface material.
In Jan-2018, the QuickSet series was revised from the QS to QT series. The new QT series offers several design advantages including layout flexibility at a lower price point, without the need for additional NRE/tooling fees.”
New QuickSet (QT series) specification
Old QuickSet (QS series) specification
Mounting pins only require 1.8mm[.071"] diameter holes in the PCB. Small footprint greatly reduces the amount of PCB space sacrificed for heat sink attachment, minimizing or eliminating the need to move board traces.
Heat sinks are mechanically attached to the PCB instead of the chip package or substrate. Shock and vibration loads are transferred to the PCB instead of the chip and solder balls.
Heat sink location and orientation is precisely set by anchor pin. The possibility of damaging the chip, heat sink, or thermal interface material during installation is greatly reduced as well as the possibility of installing the heat sink in the wrong orientation or location.
Anchor pin location can be changed to meet PCB layout requirement.
With several different torsion spring and anchor pins, appropriate attachment force can be applied.
Heat sink comes pre-assembled with clip, ready for installation.
It come easy to supervise parts and station.
Press and slide to install. Easy!
|Model||Wire Diameter (mm)||Attachment force range per a torsion spring (kgf)|
|S001YZ4J||0.8||0.8 ~ 1.2|
|S001YZ4N||0.9||1.1 ~ 1.7|
|S001YZ4M||1.0||1.5 ~ 2.3|
The torsion spring load on the heat source can be calculated by the following chart. Please note that this data is just for reference. Unknown dimensions and tolerances can significantly affect the load on the heat source.
1. Insert anchor pins from back side of PCB.
1-1. Confirm that the anchor pin is fully inserted.
2. Gently place the heat sink on the top of the chip, aligning the anchor pin and heat sink hole.
3. Attach one end of the torsion spring’s hook plate to the anchor pin.
3-1 While applying light pressure to the heat sink to keep it level, press the hook plate down.
3-2 Slide the hook plate to outside of the heat sink. Anchor pin is locked to the hook plate.
4. Attach the hook plate of other side as the same procedure with step 3.
Removal procedure can be done in the reverse order of the installation procedure.
If a phase change material is used with the heat sink, remove the phase change material completely from the chip and heatsink, then, apply a new piece of thermal interface material.
We can customize QT series. Typically we can change hole location, overall height, etc... without tooling/NRE fee. Please choose the heatsink and provide customization details to sales.
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