We would like to announce two passive heat sinks for Intel Xeon (Nocona).
Both heat sinks are manufactured by Alpha's MicroForging(R) process. The copper embedded base reduces spreading resistance, providing for more efficient heat transfer.
The base size is 78.5 x 90 mm. The U8090C-25 (for 1U) features a 0.55mm fin thickness, 1.99mm fin gap, and an overall height of 25mm. The L8090C-51 (for 2U) features a 1.15mm fin thickness, 3.58mm fin gap, and the height is 50.8mm.
There are two surface finish options: black anodized and non-anodized. The Non-anodized version offers a lower unit price in both small and production quantities. Please visit our online catalog Intel Xeon Heatsink for details.
Shipment will begin on or around the end of December 2004.
© 2007 Alpha Novatech, Inc.